Omega® Rapier / DSi / DSi-v
With an installed base of >1200 DRIE process modules, SPTS’s industry-leading position is spearheaded by the Rapier module, which etches Si using...
플라즈마 Etching 공정은 Wafer 표면의 마스크되지 않은 영역을 에칭하기 위해 선택 되어진 Gas 혼합물에 RF-excitation 으로 Plasma을 생성하며 Reactive species을 이용하여 Wafer 표면의 마스크되지 않은 영역을 Etching하는 공정 입니다. Reactions(Etching)으로 형성된 휘발성 부산물들은 진공펌핑으로 제거 됩니다.
SPTS는 아래와 같은 다양한 분야를위한 Advanced Etching 기술을 제공합니다.
With an installed base of >1200 DRIE process modules, SPTS’s industry-leading position is spearheaded by the Rapier module, which etches Si using...
SPTS ICP process module is highly flexible and etches a wide range of materials including oxides, nitrides, polymers, low aspect ratio Si and...
The SPTS Omega® SynapsEtch™ etch process module uses a high density plasma source and is designed to etch strongly...
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