SPTS are pleased to announce that we will be exhibiting at the 15th Annual International Wafer-Level Packaging Conference.
IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.
We invite you to visit us at Booth No.24 to learn more about our wafer processing technologies.
Don't miss David Butler, EVP and General Manager of SPTS, who will be presenting "Fan-out Wafer Processing in the High Density Packaging Era" in Session 4 (Tues 23rd Oct, 3:00-4:30pm)
For more information regarding the conference, click here.