SPTS Technologies are pleased to be exhibiting at the 16th International Conference and Exhibition on Device Packaging, 3-5th March 2020 at the WekoPa Resort and Casino, Fountain Hills.
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields, and we invite you to visit us at booth #32 to learn more about our wafer processing technologies and solutions.
Paul Gray from SPTS will be presenting a paper titled, "Through silicon via undercut profile optimisation for 3D packaging applications" at 4:00pm on Tues 3rd March, in the 3D Integration track.
To learn more about this IMAPS conference please click here