Osprey® PECVD
PECVD for Advanced Packaging For advanced packaging applications, SPTS' Osprey PECVD system...
PECVD
Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process which uses the energy within the plasma to induce reactions at the wafer surface that would otherwise require higher temperatures associated with conventional CVD. Energetic ion bombardment during deposition can also improve the film's electrical and mechanical properties.
Delta™ Deposition Systems
SPTS's Delta™ PECVD systems are used for a wide range of applications within MEMS and compound semiconductor industries, particularly in applications where a low processing temperature is required.
Osprey® Deposition Systems
SPTS's Osprey® PECVD systems are used in advanced packaging in applications including deposition of via-last dielectric liners, SiCN deposition for hybrid bonding, thick SiO for inter-die gapfill, via-reveal passivation, and low temperature backside films with bow compensation
Delta® PECVD
The DeltaTM PECVD systems are used for a wide range of applications within MEMS and compound semiconductors Key...