Single Wafer Platforms

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Single Wafer Platforms

To address the requirements of both volume manufacturing, pilot production and R&D applications, SPTS offers their etch and deposition process technologies on a range of wafer-handling platform options:

fxP^® - an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.

c2L - a smaller production system for 3 – 8” wafers, supporting up to 3 process modules for flexibility and control.

LPX - combines a manually-loaded, single wafer vacuum load-lock with SPTS etch or deposition plasma sources to produce a low-cost platform for low volume or R&D applications.

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Single Wafer Platforms