These are upgrades that provide a product improvement, e.g. improved quality (yield), speed (throughput), endpoint control and/or reliability.
Popular Enhancements include:
fxP Transport Module
- 200mm Integrated GTM Degas – Free’s up PM position for additional capacity
- Automated Conditioning Buffer Stations – Automated conditioning wafers, free’s up load ports and load locks – reduces operator intervention – lowers costs of operations
PVD
- ProFlux - Improved Ag/Au CoC, Mo, Ru, W NU reduction
- SE-LTX Co-Pasting Improved UBM Etch low Rc, lowest CoO upgrade
Etch
- Rapier High Bias Power Matching Unit improves oxide etch rate for silicon DRIE modules
- End Point Detection (EPD) fully integrated solutions for a range of processes and applications, sophisticated software analysis and control tools for highly productive systems
PECVD
- RPS Cleans NH3 high flow rapid clean upgrade.
RE – Release Etch
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CVE High Selectivity Upgrade - Increases selectivity to SiN and SiO2 to >5,000:1
This is only a small selection of popular enhancement available. Please contact local sales and service for a detailed review of options available to your system and application