SPTS are the Platinum sponsorship for the 2018 NCAP & Yole Advanced Packaging & System Integration Technology symposium taking place at the Wuxi Hotel in China on 20 - 21 June 2018.
SPTS invites you to join David Butler, EVP & General Manager SPTS, who will be presenting on Thursday 21st June at 09:00-09:25. Session #3 – Fan-Out Wafer Level Packaging on 'Fan-out Wafer Processing in the High Density Packaging Era'.
For more information regarding the conference, click here.