Omega® Rapier / DSi / DSi-v
With an installed base of >1200 DRIE process modules, SPTS’s industry-leading position is spearheaded by the Rapier module, which etches Si using...
電漿蝕刻
等離子體蝕刻涉及對選定的氣體混合物進行射頻激勵，以產生具有正確反應性物種的等離子體，以蝕刻晶圓表面上任何未掩蓋的區域。反應形成揮發性副產物，其通過真空泵抽除去。
Omega® 蝕刻系統
SPTS為各種應用提供先進的蝕刻技術
Omega® ICP
SPTS ICP process module is highly flexible and etches a wide range of materials including oxides, nitrides, polymers, low aspect ratio Si and...
Omega® SynapsEtch™
The SPTS Omega® SynapsEtch™ etch process module uses a high density plasma source and is designed to etch strongly...