Xactix® e2
The Xactix® e2 is an ideal solution for those seeking a low cost, table-top R&D xenon difluoride etching system. Key to successful research is...
XeF2 釋放式蝕刻
Xactix® XeF2 釋放式蝕刻系統
使用二氟化氙对矽進行等向性蝕刻是釋放 MEMS 裝置的理想解決方案。XeF2 展現了幾乎所有標準半導體材料 (光阻層、二氧化矽、氮化矽及鋁) 對於矽的高選擇比。XeF2 作為氣相蝕刻劑，可以避免通常與濕式或電漿蝕刻制程相關聯的許多問題。
SPTS 提供下列 Xactix® 二氟化氙蝕刻系統
Xactix® X4 Series™
The accelerated etch rates and superior components make the Xactix® X4 ideal for intensive R&D and pilot production. It is the leading XeF2 etch...
Xactix® CVE
The CVE module is compatible with SPTS' cluster platforms, and has a unique chamber design which provides high etch rates, uniformity and efficiency....