The 23rd Electronics Packaging Technology Conference (EPTC 2021) is an International event organized by the IEEE RS/EPS/EDS Singapore Chapter and sponsored by IEEE Electronics Packaging Society (EPS). EPTC 2021 is a virtual event, will include Keynotes, Panel session, Invited talks, Technical paper presentations, Technology talks, Virtual exhibitions, Panel and HIR Workshop.
Richard Barnett from SPTS will be presenting, "Plasma Dicing - a Key Enabler for Heterogenous Integration and Hybrid Bonding".
For full details about the schedule, go to https://www.eptc-ieee.net/