Omega® Rapier / DSi / DSi-v
With an installed base of >1200 DRIE process modules, SPTS’s industry-leading position is spearheaded by the Rapier module, which etches Si using...
Plasma etching involves RF-excitation of a selected gas mixture to create a plasma with the right reactive species to etch any un-masked areas on the wafer surface. The reactions form volatile by-products which are removed by vacuum pumping.
SPTS offers advanced etch technologies for a wide range of applications within:
With an installed base of >1200 DRIE process modules, SPTS’s industry-leading position is spearheaded by the Rapier module, which etches Si using...
SPTS ICP process module is highly flexible and etches a wide range of materials including oxides, nitrides, polymers, low aspect ratio Si and...
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