Xactix® e2
The Xactix® e2 is an ideal solution for those seeking a low cost, table-top R&D xenon difluoride etching system. Key to successful research is...
Xactix® XeF2 干法释放蚀刻
选择性XeF2气相腐蚀去除硅牺牲层
用二氟化氙对硅进行各向同性刻蚀是释放MEMS器件的理想解决方案。XeF2对硅的选择性超过了几乎所有的标准半导体材料，包括光刻胶、二氧化硅、氮化硅和铝。作为一种气相腐蚀方法，XeF2避免了许多通常在湿法或等离子刻蚀工艺中发生的问题。
SPTS提供了一系列工艺系统，从用于研发的桌上型设备e2，到可集成到批量生产平台的CVE模块。
Xactix® X4 Series™
The accelerated etch rates and superior components make the Xactix® X4 ideal for intensive R&D and pilot production. It is the leading XeF2 etch...
Xactix® CVE
The CVE module is compatible with SPTS' cluster platforms, and has a unique chamber design which provides high etch rates, uniformity and efficiency....