"Plasma Etch Processing for Power & Wide BandGap RF End Markets" Michael Yi
(SEMICON China 2021)
"Blanket Silicon Etching Processes for Advanced Packaging Applications including Via Reveal, Post-Grind Smoothing, Extreme Thinning and FO-WLP" D. Thomas
(SEMICON SEA)
"Through silicon via undercut profile optimisation for 3D packaging applications" P. Gray
(IMAPS Device Packaging 2020)
"Processes to Enable SiC and GaN Based Power and Optical Applications" R. Barnett
(SEMICON Taiwan 2019)
"Advances in doped AlN deposition techniques for next generation Piezo-MEMS" N. Knight
(SEMICON Europa 2018)
"Trends in Plasma Processes for SiC/GaN for Power Applications" R. Barnett
(SEMICON Taiwan 2018)
"Novel End-Point solution for improvement in Die Strength and Yields with Plasma Dicing (AG) in volume production" Jo Carpenter
(EPTC 2017)
"Plasma Dicing: The Lower Cost of Ownership Route to Thinner/Smaller/Stronger Die" R. Barnett
(Yole Dev. Tech Symposium 2017)
"Improving the productivity of Plasma Etch processing for PiezoMEMS applications" R. Barnett
(SEMICON Taiwan 2017)
"Fantastic Fan-Out. Improving interconnect productivity for the fastest growing packaging platform" A. Barker
(SEMICON West 2017)
"Plasma Dicing: Reducing the Cost of Singulating Thinner, Smaller Die" R. Barnett
(SEMICON SEA 2017)
"Extreme Wafer Thinning to 5μm for Low Cost Via-Last" D. Thomas
(SPTS/imec joint paper at 3D-ASIP 2016)