PVD for Photonics and Optoelectonics

SPTS offers PVD processes depositing metals on compound semiconductor substrates for VCSELs, LEDs and other optoelectronic devices, along with 300 mm Si for Integrated Photonics Advanced Packaging.  Applications include diffusion barriers, Au interconnect, stress compensation layers and Si UBM/RDL.

Key Benefits

  • Single wafer processing for improved yield
  • Reliable handling of fragile compound semiconductor substrates
  • ESC compatible with sapphire carriers without the need for a back-coat

Related Product Information

Plasma Processes for Photonic Devices

Download this datasheet giving an overview of SPTS's etch and deposition processes used to manufacture a range of photonic products such as LEDS, optical waveguides, VCSELs and lasers.

Download

Plasma Processes for VCSELs

New applications for VCSELs include proximity sensing for automotives and gesture/face recognition for consumer products and SPTS offers a range of processes for VCSEL manufacturing including ICP etch, PVD, and PECVD.

Download

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