Products

SPTS Products

Available on a range of wafer handling platforms, SPTS supplies semiconductor wafer processing systems for volume production, R&D or pilot production environments. Served markets include Advanced Packaging, MEMS, LEDs, Power Semiconductors, and High Speed RF-ICs.

Technologies and Process Solutions offered include:

• Plasma Etch
• Plasma Dicing
• HF Release Etch
• XeF₂ Release Etch
• Metal Deposition (PVD)
• Molecular Vapor Deposition (MVD)
• PECVD

Single Wafer Platforms

SPTS's ICP, DRIE, PECVD, PVD and MOCVD modules are available on 3 wafer handling platforms:

• fxP^® - 100 to 300mm wafer size. Supports Etch, PVD, PECVD, MOCVD and HF Release modules
• c2L^® - 3" to 200mm wafer size. Supports Etch, PVD, PECVD, MOCVD and HF Release modules
• LPX - 3" to 200mm wafer size. Supports Etch & PECVD modules only

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