"Plasma Etch Processing for Power & Wide BandGap RF End Markets" Michael Yi

(SEMICON China 2021)

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"Blanket Silicon Etching Processes for Advanced Packaging Applications including Via Reveal, Post-Grind Smoothing, Extreme Thinning and FO-WLP" D. Thomas

(SEMICON SEA)

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"Through silicon via undercut profile optimisation for 3D packaging applications" P. Gray

(IMAPS Device Packaging 2020)

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"Improved Semiconductor Device Reliability from Plasma Dicing" R. Barnett

(IWLPC 2019)

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"Processes to Enable SiC and GaN Based Power and Optical Applications" R. Barnett

(SEMICON Taiwan 2019)

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"VCSELs for 3D Sensing" R. Barnett

(SEMICON Taiwan 2019)

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"PVD Developments for High Density RDL" C. Jones

(SEMICON Taiwan 2019)

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"Entering the Age of a Trillion Sensors" C.Jones

(SEMICON West 2019)

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"VCSELs for 3D Sensing" D. Thomas

(SEMICON Korea 2019)

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"Optimizing Surface Chemistry after Plasma Dicing" J. Hopkins

(SEMICON Europa 2018)

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"Advances in doped AlN deposition techniques for next generation Piezo-MEMS" N. Knight

(SEMICON Europa 2018)

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"Trends in Plasma Processes for SiC/GaN for Power Applications" R. Barnett

(SEMICON Taiwan 2018)

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"Still Puzzled about Plasma Dicing?" R. Barnett

(SEMICON Taiwan 2018)

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"Overcoming PVD Production Challenges of AlScN PiezoMEMS" A. Barker

(SEMICON Taiwan 2018)

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"Novel End-Point solution for improvement in Die Strength and Yields with Plasma Dicing (AG) in volume production" Jo Carpenter

(EPTC 2017)

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"Plasma Dicing: The Lower Cost of Ownership Route to Thinner/Smaller/Stronger Die" R. Barnett

(Yole Dev. Tech Symposium 2017)

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"Laser via formation for advanced packaging" N. Bar-Yaakov

(SEMICON Taiwan 2017)

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"Improving the productivity of Plasma Etch processing for PiezoMEMS applications" R. Barnett

(SEMICON Taiwan 2017)

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"Fantastic Fan-Out. Improving interconnect productivity for the fastest growing packaging platform" A. Barker

(SEMICON West 2017)

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"RC Management for next generation PVD UMB/RDL Metallization Schemes" N. Knight

(CSPT 2017)

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"Plasma Dicing: Reducing the Cost of Singulating Thinner, Smaller Die" R. Barnett

(SEMICON SEA 2017)

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"How Plasma Dicing is Becoming Mainstream" D Butler

(SEMI European 3D Summit 2017)

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"Extreme Wafer Thinning to 5μm for Low Cost Via-Last" D. Thomas

(SPTS/imec joint paper at 3D-ASIP 2016)

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"How Plasma Dicing is Finally Becoming Mainstream" R. Barnett

(Be-Flexible 2016)

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"High Productivity UBM/RDL Deposition By PVD For FOWLP Applications" C.Jones

(IWLPC 2016)

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