Plasma Processes for Compound Semiconductors
Overview of the plasma processing technologies which SPTS offers for a variety of compound semiconductor applications such as RF, power and photonic device manufacturing.
下载PECVD for RF-IC
The Delta APM is widely used in production for RF-IC semiconductor applications. SPTS develops processes and hardware for smaller wafer sizes for today’s production needs with extendibility to larger wafer sizes, without the need for new hardware. Single wafer processing enables unrivalled repeatability and flexibility in a manufacturing environment
Our handlers and process chambers are proven in high volume production, and are fully compatible with both transparent and carried wafers.
Benefits of SPTS PECVD for Compound Semiconductor RF-IC
- One chamber for all wafer sizes
- Industry-leading uniformity and repeatability
- SiN with proven reliability for MIM capacitors
- High deposition rate SiN with tuneable stress for passivation
- TEOS-based SiO for enhanced step coverage
- Low H SiN films
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