SPTS 提供适合批量生产、研发或试生产环境的半导体晶圆加工系统,这些系统可在一系列晶圆处理平台上使用。服务的市场包括先进封装、MEMS、LED、功率半导体和高速 RF-IC。
SPTS 的 ICP、DRIE、PECVD、PVD 和 MOCVD 模块可在 3 个晶圆处理平台上使用:
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